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芯片和电路板的关系_芯片和电路板的关系

时间:2025-02-11 13:16 阅读数:5498人阅读

GolOpticsappliesforpatentsrelatedtochiptestcircuitboardstoimprovesamplingcurrentaccuracyandaccuracyonOctober31,2024,informationfromtheStateIntellectualPropertyOfficeshowsthatGoerOpticsTechnologyCo.,Ltd.appliedforanamecalled"Patentforchiptestingcircuitboardandchiptestingassembly,publicationnumberCN118837720A,applicationdateisJuly2024.Patentabstractshowsthatthepresentinventionproposesachiptestcircuitboardandchiptestassembly,involvingthefieldofchipdetectiontechnology,chiptestelectricity...

芯片和电路板的关系

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lianyucoOWNPCB,芯片和spemendoductOrcuircuitboard?doesthecompanyhavealayOutOfsensors?

aichipsdrivetheexplosionofthepcbindustrychain! Amongthem,BaodingTechnology,JinanGuojiandShengyiTechnologyhitthedailylimitstrongly,Qiangdacircuitsrosebymorethan10%,FounderTechnology...WiththecontinuousincreaseinthedemandforAIchipcomputingpower,themarketdemandforhigh-endPCBproductshasshownexplosivegrowth. 。 ATTHESAMETIME,therapiddevelopmergefemergingfieldssuchasnewenergyvehiclesandand5gcommunicationshasfurtherexpandedp...

HuaweiCompanyappliesforapatentforachip,circuitboardassemblyandcommunicationdevicetoreducesystemcosts.FinancialcirclesreportedonMarch26,2024thataccordingtotheannouncementoftheStateIntellectualPropertyOffice,HuaweiTechnologyCo.,Ltd.appliedforapatentcalled"A"Chip,circuitboardassemblyandcommunicationdevice",publicationnumberCN117767992A,applicationdateisSeptember2022.Patentsummaryshowsthatachip,circuitboardcomponentandcommunicationdeviceareusedtoreducetheareaof​​chipsthatintegratesatellitepositioningandsatellitecommunicationfunctions,andreducethesystemformation...

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ShennanCircuitappliesforpatentsforembeddedchipprintedcircuitboardsandtheirproductionmethodstorealizechipsandprinting...ShennanCircuitCo.,Ltd.appliesforaprintedcircuitboardcalled"aembeddedchipprintedcircuitboard...ShennanCircuitCo.,Ltd.appliesforaPatentofthepatentof",publicationnumberCN118946029A,applicationdateisJuly2024. Aptentsummaryshowsthatthatthatthatthatthatthatthatsclosessaprintedcirtedcirbuitburiedwithachipandaproductionmethodthere.themethododofproducingaprintedcirtedcircuitboardboardbobloberwithachipincincludes:provistionAsubstrateToto...。

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Ludaofeng:Freshairsystemproductsareproducedbyself-producedmotors,motorcontrolchipsandcircuitboardspurchasedfromoutside,intelligentmanufacturing...FinancialindustryreportedonMarch9thataninvestoraskedGreenIslandWindonaninteractiveplatform:DearSecretarytotheBoard:Isthemotor,motorcontrolchipandcircuitboardofyourcompany'sindoorventilationsystemdesignedandproducedbyyourcompanyorproducedbytheOEMfactory?Furthermore,yourcompanyhasbeenthefirsttodeployintelligentmanufacturingintheindustrysince2022. ,AcceleRateThepopularizationandApplicationOffReshairsystems。 howistheprojectprogressingnow?谢谢...

fangbangco。 公司,Zhuhaidachuangelectronicsco。 AtmummaryshowsthatthatthatththatththatththatthendisclosesacompositemetalfoilandAlfoilandAmeTametal-coveredlamination板...

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SuzhouHuataiElectronicTechnologyCo.,Ltd.obtainschipmodules,circuitboardsandchipmanufacturingmethods...FinancialIndustryNewsonOctober21,2024,informationfromtheStateIntellectualPropertyOfficeshowsthatSuzhouHuataiElectronicTechnologyCo.,Ltd.obtainschipmodules,circuitboardsandchipmanufacturingmethods...FinancialIndustryCo.,Ltd.reportonOctober21,2024,informationfromtheStateIntellectualPropertyOfficeshowsthatSuzhouHuataiElectronicTechnologyCo.,Ltd.obtainsApatentcalled"ChipModule,CircuitBoardandChipManufacturingMethod" ,授权努力,申请DateIsjune2024。

shuanglinco。 TheCompanyObtaineda"CarringDeviceForCheckingTheweldingQuircuitChipsChips",授权annuneunnounounounununununumbercn106546909b,andtheApplicationDateDateDateDateDateDateWasoCtober2016。 Aptentsummaryshowsthatthatthatththatththatththatthatthesclosesberatedeviceforecheckingtheweldingqualiceofcircuitboardchips,包括base(1),旋转...

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shennancircuitappliedforPatentForChipeMbeddedCirtedCircuitboardAnditSpreParationMethod,andCanpassThroughoughMetal...thePresentIniventionDisclosesClosesClosesChipembeddedPrintedCircirtedCircirintedCircuitBoardAnditspreParationMethodmethodmethodmethod,WhereInChipeMbedembedCircirbuitboildedcircirbuitboarded。 Theprintedcircuitboardincludes:atargetcircuitboard,achipunit,apluralityofconnectorsandaheatdissipationdevice.Aninstallationgrooveisformedonthefirstsideofthetargetcircuitboard.Thechipunitisfixedlyinstalledinthecorrespondinginstallationgroove.Thechipunitincludesametalsubstrate. Andchip;thechipixed,laminatedandArnangedandConnectedTothemetalSubstrate...

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