电路板上不同芯片的功能
...允许通知chiptyChiptodirectlytransfertheteftefeltefeltcoolingwatertotheprocesoronthecircuitboard...thecoolingWaterChannElissusedtocoolTocoolThecircuitboard。 thetemperaturesensingElementIncludeSatemperaturesEnsingChipandAtemperaturesEnsingElementArmentArrangedOntheteNtemperaturesEnsingChip。 Thetemperaturesensingchipissetonthecircuitboard,whichcancelsthewiringharnessconnectionbetweenthetemperaturesensingchipandthecircuitboard,sothatthetemperaturesensingchipcandirectlytransferthetemperatureofthefeltcoolingwatertotheprocessoronthecircuitboard,therebyacceleratingtheentiremotorcontrol. Theythementrument的效率。 PropoctionOfthewateRageRageAreAtowardStheCircuitboard...
...Thecompanyhasobtainedpatentsforcircuitboardsandelectronicequipment,effectivelyreducingtheconnectionfunctionbetweenchips...Applyforprovidingacircuitboardandelectronicdeviceforconnectingthefirstchipandthesecondchip>,thecircuitboardincludes:two-layerwiringlayer;thetwo-layerwiringlayerisarrangedwithafirstpingroupandasecondpingroup,andthefirstpingroupisusedforProvidesaccessinterfacesformultiplefunctionalareaswithinthefirstchip,andthesecondpingroupisusedformultipleb>insidethesecondchip>Functionalareaprovidesaccess...< /p>
shennancircuitappliedforpatentsforembeddedchipprintedcircuitboardsandandtheirproductionmethodStorealizeCeceChipshipshipshipshipshipshipsandprinting...FinancialIndusTryNewsonNovemb15,2024，信息fromthesttateInteLlectPropertyectualPropertyOfficesHowsthatsThatShennanccowiststhatshennanccoOundonnovember15,2024。从TheStateIntInteltectualPropertyOfficesHowshowshowshowsthathathenancircircircircircirc.，Ltd.，Ltd. thecompanyappliedforapatentCallcall被称为"AprintedCircuitboardwithaChipburiedandItsProductionMethod".pablicationno.cn118946029a，andTheApplicationDateSjuly2024。 Aptentsummaryshowsthatthatthatthatthatthatisclosessprintedcirtcirboitboardwithachipburiedandaproductionmethodthereof，其中ininthechipburied...
huaweicompanyappliesforcircuitboards，chipsandelectronicequipmentpatents，降低theoccurrenceoftransmissimrines...FinancialIndustrynewsonfebruary19,2024，根据theStateIntEltectualPropertyofficeLopertyOfficePropertyOfficeSectualPropertyofficechitirporport，huaweitpoardatirirporter.litefter.litefter.ltforefl.ltforectrectrect.irim，ltdefforce,，Onicdevice"，PublicationNumbercn117560838a，andtheapplicationDateSaugust2022。 专利权示威，embodimentOfthePresentApplicationDisclosesAcircuitboard，chipandelectronicdevice，包括ludeSatransmissionline，其中ininthetransmissionlinelansimpersionlineincludesludesludesafirstsignalline，...
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GuanghetechnologyAppliedforpatentsforchipmountingsurandMountingMethodMethodeFrintedCirtboards，避免...避免...核心和thefirstopentoperencenareCommunicarationAryCommunicationArnicationAncommunicationAncommunicationAncommunicationandarearrangedoneOne； 删除e;fixthechiptotheprintedcirtedcirboitboardbysolderpaste，其中ininthepinsoftheciphechipareconnectedbysolderpasteanderpasteandersolderlesistersistdefinitionpads;ininthevolumeofthevolumeofthefthefthefthefthefthefthefthanthanthanthanthanthathanthanththanththanthevolumeoftheseconeconeconeconeconeconeconeconeconeconeconeconeconecondopen。 thetechnicalsolutionsprovidedbyembodimentsofthepresentininventionventheventheriskofshortCircuitBetwoAdjacentSoldElderMaskDefinitionPads。 这个...
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SuzhouHuataiElectronicTechnologyCo.,Ltd.obtainschipmodules,circuitboardsandchipmanufacturingmethods...FinancialIndustryNewsonOctober21,2024,informationfromtheStateIntellectualPropertyOfficeshowsthatSuzhouHuataiElectronicTechnologyCo.,Ltd.obtainschipmodules,circuitboardsandchipmanufacturingmethods...FinancialIndustryCo.,Ltd.reportonOctober21,2024,informationfromtheStateIntellectualPropertyOfficeshowsthatSuzhouHuataiElectronicTechnologyCo.,Ltd.obtainsApatentcalled"ChipModule,CircuitBoardandChipManufacturingMethod" ，授权努力，申请DateIsjune2024。
SenbaSensor:Thecompany'sproductsdonotinvolvesemiconductorPCBcircuitboardsandchips.AccordingtothefinancialindustryonJuly4,aninvestoraskedSenbaSensoronaninteractiveplatform:Hello,SecretaryoftheBoard,thecompanyinvolvessemiconductorPCB. 电路板和chipswerswers：thecompany'sproductsdonotinotinotinotignotemendonductorpcbcircuitboardsandchipsandchips。 thisArticleComeSfromaiteLegramintheFinancialIndustry
...Completelycompletetheverificationofglass-basedcircuitboardandchiplaserbondingprocesswithleadingcustomersinthedisplayindustry.FinancialcirclesreportedonDecember16thataninvestoraskedYitianCo.,Ltd.onaninteractiveplatform:Thecompany'sadvancedpackagingbondingDoestheprocesshavesimilarcharacteristicstoHuawei'shybridbondingtechnology?Thecompanyreplied:Thecompany'ssubsidiaryYitianSemiconductorhasjointlycompletedtheverificationofglass-basedcircuitboardandchiplaserbondingprocesswithleadingcustomersinthedisplayindustry,andthehugeamountoftransfereffectivelysolvestheglass. thebaseofthebasecircuitboardduringRoffrowsoldOltering...
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...Automobilecurrentsensorpatent，withefectoffectoffacilitatingRepairandrepairandreplacementOfCircuitBoardSorhallchips，Isjune2024。 ApplicationApplicationProvidesAcurrentsEcurrentsenerfornewenergyvehicles，涉及涉及fieldefieldofcurrentsensors的专利。 Itincludes：Ashellandashellcover，AnironcoreanDacircuitareProvidedInthell，AndahallChipisProvidedonTheCircuitboard，andTheShellCoverAndThEshellareFixlareFixStleyThrocconnectedThrOCnectedThrOCnectIndThroughAconNectingMechanics.theconnectingmechnectingMechanImCincludes：Acconnectingmoneonnectingcommenent。 thisapplicationhastheconverienceofrepairingcircuitboardsorhallchipsand...
shuanglincothefocallengthposionsalignipopoper;eTectOftheWeldingQualityofChippinSonthecircuitboard;theSnoneedtofocusfrequallyspocecirtwoblober，sothattheInspectionWorktworkofthecircuitobledboardpobloberPrododauctlineLlineIspartLineSissIsparriedOudountiSsissIsparriedOudountiSsissIsparriedOutount。 ，实现EpuroducReDucingWorkStrentmentyandReducingMissedDetectionAndectionAndErdectionRate。 ...
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